Worldsoaring uses Class 1000 dust-free workshop and oil-free cutting process to ensure that there is no metal dust and oil residue during the processing, and the surface cleanliness reaches ≤0.1mg/cm², which meets the ultra-high cleanliness standards of semiconductor equipment (such as wafer transfer manipulators and vacuum chambers).

With five-axis ultra-precision CNC (precision ±0.003mm), key components in semiconductor equipment can be processed, such as EFEM frame, lithography machine positioning platform, vacuum valve, etc., to ensure nano-level motion accuracy and avoid wafer processing errors caused by micro-vibration.

Specialized in aluminum alloy (6061-T6), stainless steel (316L VM), ceramic composite materials and other semiconductor-specific materials, through mirror polishing (Ra≤0.1μm) and passivation treatment, to meet the long-term stability requirements in extreme environments such as high vacuum and plasma corrosion.

Adopt anti-static processing technology to avoid electrostatic adsorption particles during CNC process; all parts are cleaned by ultrasonic + plasma to ensure no residue, in line with SEMI F47 semiconductor equipment standards.

15-day rapid mass production: meet the urgent expansion needs of semiconductor equipment Laser coding + blockchain traceability: record material batches and processing parameters, support 10 years of data traceability, and comply with SEMI E142 standards

Supplied to the world's top 5 semiconductor equipment manufacturers, including: Wafer transfer robot: cumulative delivery of 100,000 sets, yield 99.99% Etcher chamber: processing accuracy ±0.005mm, plasma corrosion resistance life increased by 2 times Lithography machine structure: thermal deformation coefficient <0.001mm/℃, ensuring process stability below 28nm